October 5, 2009
Murata Manufacturing Co., Ltd.
President/ Statutory Representative Director: Tsuneo Murata
Murata Manufacturing Co., Ltd has developed 50μm-thick ultra-low profile capacitor, the thinnest of its kind in the world.
Unrivaled this ultra-low profile capacitor, with its thickness of 50 μm, can be placed directly beneath components such as ICs, contributing to making of lighter, thinner and smaller equipment. It further contributes to enhancing equipment features by reducing inductance in wiring patterns.
As mobile equipment and modules continue to become more compact, high density mounting technology is going through a significant advancement. Next generation mounting technology keeps in scope the technology to build passive components into substrates.
Requirements for substrate built-in components such as external electrode material, flatness, laser resistance and toughness, are more stringent compared with surface-mounting components. Based on our leading-edge dielectric material technology and external electrode formation technology, we have succeeded in developing a low profile built-in capacitor 1005 size (1.0 x 0.5mm) 50μm thin with 0.1μF capacitance.
LXFC*series
| Dimensions | 0.6×0.3mm | 1.0×0.5mm |
|---|---|---|
| Thickness | 0.05mm | 0.05mm |
| Capacitance (@1kHz) | 0.01μF | 0.1μF |
| Insulation resistance (@4V) | ≧10MΩ | ≧1MΩ |
| Nominal voltage | 4V | 4V |
| Temperature characteristics | X5R | X5R |
A production capacity of 1 million units per month in April 2010 is scheduled.
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