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Challenge for Downsizing Technology

In the world of electronic devices and components, downsizing is always the way to go. For example, Murata's chip monolithic ceramic capacitors have become as small as EIA 01005 size (0.4 mm x 0.2 mm). This was only made possible with the combination of technology to print electrodes that are microns thick on a dielectric sheet, and technology to laminate those layers precisely. Downsized components not only contribute to downsizing devices, but also allow extra freedom in the circuit design for adding more features and values. Murata also offers a solution for the increasingly serious problem of mounting downsized components.

Minimizing Mounting Footprints

A chip monolithic ceramic capacitor's footprint was 3.2 mm x 1.6 mm in 1970. It was reduced to 1.6 mm x 0.8 mm in 1983, 1.0 mm x 0.5 mm in 1990. By 1997, the footprint shrank rapidly to 0.6 mm x 0.3 mm. In spite of having equal capacitance, the footprint in 1997 is approximately 1/6 of the size in 1990.

Minimizing Mounting Footprints

Internal Microstructure of Chip Monolithic Ceramic Capacitors

Being comprised of 1 µ m dielectric layers with even and minute crystal grains, chip monolithic ceramic capacitors are highly reliable.

Internal Microstructure of Chip Monolithic Ceramic Capacitors

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